When comes to magnetic material sputtering, no one offers more expertise than Sequoia Vacuum Corp. Our design is known for simplicity, ease of use and high reliability. It presents the smallest profile and deliver higher deposition rate than any comparable sources.
Deposition Source 
Power Supply 
Power Supply
Features
- RF or DC
- Magnetic or Non-magnetic
- Vertical or Horizontal
- Water cooled (islolated from cathode)
- Angular adjustment
- Linear adjustment
1.3″ Source
- 1.3″ diameter sputter targets
- Vertical, horizontal, flexmaount, and flange mount configurations
- Operates RF or DC
- Sputters magnetic and non-magnetic materials
- HV and UHV configurations
- Water cooled
2.0″ Source
- 2.0″ diameter sputter targets
- Vertical, horizontal, flexmaount, and flange mount configurations
- Operates RF or DC
- Sputters magnetic and non-magnetic materials
- HV and UHV configurations
- Water cooled
3.0″ Source
- 3.0″ diameter sputter targets
- Vertical, horizontal, flexmaount, and flange mount configurations
- Operates RF or DC
- Sputters magnetic and non-magnetic materials
- HV and UHV configurations
- Water cooled
4.0″ source
- 4.0″ diameter sputter targets
- Vertical, horizontal, flexmaount, and flange mount configurations
- Operates RF or DC
- Sputters magnetic and non-magnetic materials
- HV and UHV configurations
- Water cooled
6.0″ source
- 6.0″ diameter sputter targets
- Vertical, horizontal, flexmaount, and flange mount configurations
- Operates RF or DC
- Sputters magnetic and non-magnetic materials
- HV and UHV configurations
- Water cooled
DC
- Superior arc suppression
- Universal input voltage
- Regulate power, voltage, current
RF
- Air cooled
- RS 232 / 422 / 485
- Master / Slave operation
- CE Mark